Advantech AFE-R360

AFE-R360C5-Q3A1, AFE-R360C5P-Q5A1, AFE-R360C7-Q8A1, AFE-R360C7P-Q8A1, AFE-R360C7PX-Q8A1, AFE-R360C7X-Q8A1

3.5" Mainboards

PRODUCT FEATURES

// 3.5" Industrial Mainboards
// [Intel Core Ultra 5 Processor 125H | Intel Core Ultra 5 Processor 125U | Intel Core Ultra 7 Processor 155H | Intel Core Ultra 7 Processor 155U]
// SoC (System on a Chip)
// 262-pin SO-DIMM DDR5
// 3 x G-LAN (Back side)
// 4 x USB (Back side)
// 2 x USB (internal)
// 4 x Seriell I/O
// Digital I/O (8-Bit)
// Power Supply DC 12 to 24V

CONFIGURATION

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Standard Configuration Custom Configuration

PRODUCT PRICE

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Sales only to business customers.
Delivery time: upon request

Basic Module: Advantech AFE-R360

General information
SKU / Item NumberAFE-R360AFE-R360C5-Q3A1, AFE-R360C5P-Q5A1, AFE-R360C7-Q8A1, AFE-R360C7P-Q8A1, AFE-R360C7PX-Q8A1, AFE-R360C7X-Q8A1
Product Basic Data
ManufacturerAdvantech
System
ProcessorVertical SegmentMobile
SeriesIntel Meteor Lake
NumberIntel Core Ultra 5 Processor 125H, Intel Core Ultra 5 Processor 125U, Intel Core Ultra 7 Processor 155H, Intel Core Ultra 7 Processor 155U
CPU cores12 Pce, 14 Pce, 16 Pce
Threads14 Pce, 18 Pce, 22 Pce
SocketBGA 2049
Performance core base clock frequency1,2 GHz, 1,3 GHz, 1,4 GHz, 1,7 GHz
Performance Core Max Turbo Frequency4,3 GHz, 4,5 GHz, 4,8 GHz
Efficient-core base clock frequency0,7 GHz, 0,8 GHz, 0,9 GHz, 1,2 GHz
Efficient-core Max Turbo Frequency3,6 GHz, 3,8 GHz
Cache12 MB, 18 MB, 24 MB
Thermal Design Power (TDP)15 W, 28 W
ChipsetSoC (System on a Chip)
MemoryStructure262-pin SO-DIMM DDR5
Memory TypeDDR5
Frequency5600 MHz
Slots2 Pce
Maximum expansion96 GB
BIOSAMI UEFI 256 Mbit SPI
Graphics
DisplayPortMaximum resolution4096 x 2160 at 60 Hz
Version1.4A
Extension
M.2Slot 1Key IDE
InterfacePCIe ×2, UART, USB 2.0
Supported dimensions2230
Slot 2Key IDB
Interface4G/LTE, PCIe ×2, SATA III, USB 2.0
Supported dimensions3042, 3052
Slot 3Key IDM
InterfaceNVMe, PCIe ×4 (Gen 4)
Supported dimensions2280
Slot 4Key IDM
InterfaceNVMe, PCIe ×4 (Gen 4)
Supported dimensions2280
M.2 Key IDsB, E, M
SIMQuantity1 Pce
Form Factor (Slot)Nano SIM
StorageM.2
B2BI2C, MIPI-CSI
Audio
ChipsetRealtek ALC888S-VD2-GR
Network
G-LANControllerChipsetIntel I226LM PCIe (10/100/1000/2500 Mbps)
Quantity3 Pce
Network3x G-LAN
Externe I/O (Front Panel)
USBUSB v4.0 Type CSpecificationGeneration 2
Data transfer modesDisplayPort v.1.4
Externe I/O (Rear Panel)
DisplayDisplayPort1 Pce
DP USB-C2 Pce
EthernetRJ-453 Pce
USBUSB 3.2 (Gen 2)2 Pce
USB v3.2 (Gen 2, Type C)2 Pce
Internal I/O
USBUSB 2.0Ports (2.00 mm pitch)2 Pce
USB 3.2Ports (Type-C socket)1 Pce
SerialRS-232 / 422 / 485Ports (2.00 mm pitch)4 Pce
Digital I/OBits8-bit1 Pce
SMBus1 Pce
I²C (Inter-Integrated Circuit)1 Pce
CAN busChannel2 Pce
ProtocolCAN-FD
Watchdog Timer
Watchdog TimerYes
Watchdog timer (interval)Programmable via software (1 - 65535 seconds)
Safety
Trusted Platform Module (TPM)dTPM 2.0 (Hardware)
Power Supply
Typ (Input)DCWide RangeYes
Range12 to 24V
Connector2-pin terminal connector
Power supply - InputDC: 12 to 24V
OS / Software
Windows EmbeddedWindows 10 Enterprise IoT LTSC (2021)wind support
LinuxDistributionUbuntu 22.04
Supported OSLinux, Windows Embedded
Cooling
ImplementationActive (fan cooling), Passive
Mechanical / Environment
TemperatureOperation0° to 60°C, -40°C to 85°C
Storage-40°C to 85°C
Relative humidityOperation5 to 95%, non-condensing
DimensionsForm factor3.5"
Width146 mm
Deep102 mm
VibrationVibration3G, 10 to 500 Hz
Weight170 g
Certificates / Conformities
CEYes
FCCClass BYes
RoHS compliantYes
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