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DFI Neues Motherboard CS181 verkleinert die Basis von Deep-Learning-Modellen mit MXM und 5G

DFI, Taiwan, 15.07.2021 - DFI introduces the new industrial motherboard CS181 (dimensions: 197.72 x 167.32 mm), which, through a simple Mini-ITX form factor, aims to increase processing speed for heavy workloads, provide insights into AI and machine learning, and enhance the performance of the regional M2M ecosystem at the edge.

 

The DFI CS181 combines the three elements essential for realizing edge machine learning. The powerful Intel® Core™ i7/i5/i3 processors of the 8th and 9th generation, the comparatively small MXM graphics processing module for accelerating image analysis, and 5G support for ultra-fast data transmission with high bandwidth. Compared to traditional AI computers with GPUs, which always require much space, the CS181 delivers the same performance with 75% less capacity by employing a slim MXM module for machine and deep learning. The insights generated are then quickly shared via 5G broadband with regional IoT devices to achieve AI-driven real-time responses collaboratively.


With its small footprint, timely data-driven decision making, and seamless integration with regional devices, the CS181 is expected to be the "small pioneer" at the forefront of computer vision, such as in AOI, AGV, AMR in factories, medical imaging, license plate recognition, and traffic flow analysis in transportation.

Features

  • Robust performance in a compact size
  • Intel® Core™ i7/i5/i3 processors of the 8th and 9th generation
  • Memory: 2 DDR4 2400/2666MHz up to 64GB
  • MXM Graphics card support: MXM 3.1 Type A/B/B+
  • 5G/BT/Wi-Fi module support and 4 LAN ports
  • Storage: 2 SATA 3.0, 1 M.2 M-Key, 1 M.2 B-Key, 1 M.2 E-Key

Applications

Built-in

  • Driverless transport vehicle (FTF)
  • Automated mobile robots (AMR)
  • Automated optical inspection (AOI)
  • Vision-guided robotics

Medical imaging

  • High-resolution diagnostic imaging

Transport

  • Traffic flow analysis
  • Automatic license plate recognition systems

Publisher of the message (text / image): DFI Inc., www.dfi.com

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